IBM Intel Xeon E5506 Especificações descarregar pdf (Página 20)

LGA1366 Socket

20 Thermal/Mechanical Design Guide

2.9 LGA1366 Socket NCTF Solder Joints

Intel has defined selected solder joints of the socket as non-critical to function (NCTF)

for post environmental testing. The processor signals at NCTF locations are typically

redundant ground or non-critical reserved, so the loss of the solder joint continuity at

end of life conditions will not affect the overall product functionality. Figure 2-7

identifies the NCTF solder joints.

Note: For platforms supporting the DP processor land C3 is CTF.

Figure 2-7. LGA1366 NCTF Solder Joints

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

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IBM Intel Xeon E5506 Especificações Página 20